Reliability Aspects of Thermal RF-Sensing Structures on Micromachined AlGaAs/GaAs Membranes
Key: MSDK+05-1
Author: K. Mutamba, C. Sydlo, L. Divac-Krnic, B. Mottet, I. Ahmed Ali, H.L. Hartnagel
Date: June 2005
Kind: In proceedings
Book title: Advanced MEMS for RF and Millimeter Wave Communications
Abstract: This paper reports on reliability analysis made on micromachined millimeter-wave power sensing structures by means of electrical pulses. As the main result of the pulsed electrical stress a degradation of sensor bolometric termination is observed. Different geometries are considered and the corresponding degradation process analysed.
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